表单

Advanced Competitiveness Engineering

Our engineers are committed to helping our customers maximize competitiveness in the global PCBA market. We collaborate closely on Bill of Materials (BOM), recommend alternative components, enhance product manufacturability, and introduce competitive suppliers and advanced technologies. Our goal is to deliver best-in-class manufacturing processes, leveraging our extensive experience in industrial PCBA design and production.

Focusing on product development and industrialization, we understand the increasing complexities of modern electronics manufacturing. We provide comprehensive Design for Manufacturability (DFM) studies to ensure high-quality production and conduct life cycle analyses to maintain a robust, reliable supply chain.

Value Engineering & Re-Engineering

● Component lifecycle management, standardization, and cost reduction through material and supplier alternatives.

● Product and subassembly redesign for enhanced performance, manufacturability, and reliability.

● Process optimization emphasizing automation, Poka Yoke, and efficiency improvements.

● With ACE, our clients benefit from engineering-driven solutions that accelerate time-to-market, reduce costs, and enhance product performance, ensuring their PCBA products remain competitive in highly demanding industrial markets.

RFQ and Engagement Review

● We conduct feasibility studies, DFM reviews, and mechanical assessments;

● We define manufacturing process flows and explore alternative options, including automated process cells in collaboration with Automated Back End (ABE) and Test and Systems Development (TSD);

​​​​​​​● We implement design-to-cost initiatives, optimize PCB outlines, suggest component alternatives, enhance manufacturability, and help develop box-build strategies.

New Product Introduction

While thriving on speed and quality, we cut down time-to-market and maintain the highest product quality.

We offer rapid prototyping and make every effort to get it right the first time. By offering process development and tool design locally, you save on valuable lead-time.

Our close collaboration with you from prototyping to mass production, while our global outsourcing team procures from global competitive suppliers, ensure that you get the best quality at reasonable cost.

At CEG, New Product Introduction or NPI is a crucial process that transforms innovative concepts intro market-ready solutions – efficiently and effectively. It includes definition, development, and launch of new or upgraded devices with the goal of creating a functional prototype under ideal conditions.

Our structured NPI process enables early involvement in manufacturing, ensuring a seamless transition from development to high-volume production. This approach guarantees that products meet stringent quality standards, are manufacturable at scale, and align with customer expectations.

​​​​​​​We actively seek meaningful partnerships with contract manufacturers early in the product lifecycle. Such collaboration accelerates time-to-market, reduces redesign costs, and enhances overall product success.

Prototyping and Manufacturing

● Quick-Turn Prototyping: Lead time of 1 week for SMT and 2 weeks for backend line.

● Standard SMT Line: Lead time of 2 weeks.

● Standard Backend Line: Lead time of 6 weeks.

Tools and Equipment

● Jet Dispense: Stencil-free solder paste jet printing.

● Solder Paste Inspection (SPI): Automated inspection of solder paste deposit.

● Mounter: Auto Pick and Place with various capabilities.

● Reflow Oven: Flexible thermal profile.

● AOI (2D and 3D): Offline inspection with a 6-phase lighting system.

● PCBA Clean: Batch-type cleaning.

​​​​​​​● Visual Inspection: Manual inspection with magnification.

● X-Ray: Offline oblique inspection.

● Flying Probe Tester: Various power supplies and testing equipment. No need for fixtures.

Design for Manufacturability (DFM)

● PCB Fabrication Review: Signal layer checks, drill and route checks.

● PCB and Mechanical Assembly Review: Component spacing, SMD land pattern checks.

● Stencil Design: Solder paste printing, adhesive printing, BGA ball attach, etc.

● Panel Design: Different circuit arrangements, step-and-repeat, combo panels, multi-board designs.

Test and Systems Development

At our company, our Test and Systems Development (TSD) team provides tailored test solutions for PCBA manufacturing, ensuring product quality, traceability, and reliability. We design and implement functional test fixtures based on customer requirements, supporting a wide range of applications from prototype validation to small- and medium-volume production.

Custom Test Fixtures: We develop functional test setups according to client specifications, integrating electrical, mechanical, and signal testing as required.

Flexible Support: Our engineers work closely with clients to adjust testing parameters, optimize coverage, and maintain high yield rates.

With TSD, our customers gain reliable and cost-effective testing solutions that support high-quality production and help maintain competitiveness in demanding industrial markets.